Crystal Boule Grinder from Germany
Precision grinder that shapes semiconductor crystal boules to exact diameter and grinds orientation flats indicating conductivity type and resistivity. Falls under HTS 8445.90.00.00 per statistical note (a)(ii)(A) for wafer preparation equipment in semiconductor processing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Submit boule diameter specs and flat grinding tolerances to confirm wafer prep classification
• Pair with end-use statement for semiconductor boule processing