8445.90.00.00/ boule Inspection Scanner/Japan

boule Inspection Scanner from Japan

Laser/X-ray scanner that maps defects and determines optimal cutting planes in semiconductor boules before slicing. Falls under HTS 8445.90.00.00 for wafer preparation equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Technical specs must show defect mapping resolution

• Classify as prep if determines slice plane