boule Inspection Scanner from Germany
Laser/X-ray scanner that maps defects and determines optimal cutting planes in semiconductor boules before slicing. Falls under HTS 8445.90.00.00 for wafer preparation equipment.
Duty Rate — Germany → United States
13.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Technical specs must show defect mapping resolution
• Classify as prep if determines slice plane