boule Inspection Scanner from Germany
Laser/X-ray scanner that maps defects and determines optimal cutting planes in semiconductor boules before slicing. Falls under HTS 8445.90.00.00 for wafer preparation equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Technical specs must show defect mapping resolution
• Classify as prep if determines slice plane