boule Inspection Scanner from Canada
Laser/X-ray scanner that maps defects and determines optimal cutting planes in semiconductor boules before slicing. Falls under HTS 8445.90.00.00 for wafer preparation equipment.
Duty Rate — Canada → United States
13.7%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Technical specs must show defect mapping resolution
• Classify as prep if determines slice plane