8445.90.00.00/Automated Wafer Handling Robot/Japan

Automated Wafer Handling Robot from Japan

Cleanroom robot transferring wafers between preparation process tools (sawing, grinding, polishing stations). Classified HTS 8445.90.00.00 as integral wafer prep equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify wafer size range and cleanroom class rating

• Prove integration with named prep tools

• Not general industrial robots (8479.50)