8443.99.50.50/Wafer Slicing Diamond Saw/Japan

Wafer Slicing Diamond Saw from Japan

Wafer slicing saws with diamond blades cut ultra-thin semiconductor wafers from monocrystalline boules while minimizing damage. Classified HTS 8443.99.5050 as printing machinery accessories for semiconductor wafer manufacturing per statistical note (a)(ii)(B). Kerf loss control is critical for yield optimization.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include blade specifications showing <50 micron kerf; critical for classification

• Document cleanroom compatibility (ISO Class 1); avoids general saw classification