Other
Printing machinery used for printing by means of plates, cylinders and other printing components of heading 8442; other printers, copying machines and facsimile machines, whether or not combined; parts and accessories thereof: > Parts and accessories: > Other: > Other > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Products classified under HTS 8443.99.50.50
Colloidal Silica Wafer Polisher
Polishers using colloidal silica slurry for final semiconductor wafer surface preparation. HTS 8443.99.5050 for wafer polishers per statistical notes. Creates oxide layer for device processing.
Czochralski Crystal Puller
A Czochralski crystal puller is specialized equipment used to produce extremely pure monocrystalline semiconductor boules from silicon or gallium arsenide melts, from which wafers are sliced. It falls under HTS 8443.99.5050 as 'other' parts and accessories for printing machinery adapted for semiconductor processing, specifically in wafer manufacturing per statistical notes. This machine employs the Czochralski method for crystal growth essential to semiconductor production.
Single-Side Wafer Polisher
Single-side wafer polishers create mirror-finish surfaces on semiconductor wafers using colloidal silica slurry for device fabrication readiness. Falls under HTS 8443.99.5050 as printing machinery parts for wafer polishing per statistical note (a)(ii)(C). Achieves sub-nanometer surface roughness.
Crystal Ingot Diameter Grinder
Precision grinders that shape crystal ingots to uniform diameter tolerances before wafer slicing, with automated profiling for resistivity flat marking. HTS 8443.99.5050 as other semiconductor wafer prep accessories per statistical notes. Maintains crystal orientation throughout process.
Multi-Wire Wafer Slicing Saw
Multi-wire saws use diamond-impregnated wires to simultaneously slice hundreds of wafers from semiconductor boules, minimizing material loss. Classified in HTS 8443.99.5050 as printing parts for wafer manufacturing per statistical note (a)(ii)(B). Enables high-volume 300mm wafer production.
Double-Side Wafer Grinder
Double-side grinders simultaneously process both wafer surfaces for thickness uniformity and parallelism prior to polishing. Under HTS 8443.99.5050 for semiconductor wafer grinding per statistical note (a)(ii)(C). Achieves <1 micron TTV across 300mm wafers.
Boule Flattening Grinder
Specialized grinders that create precise flats on semiconductor boules to encode crystal orientation and doping information. HTS 8443.99.5050 as printing parts for crystal grinding per statistical note (a)(ii)(A). Flat geometry critical for wafer alignment.
Stress Relief Wafer Lapper
Specialized lappers that remove stressed layers from inner wafer diameter after slicing. HTS 8443.99.5050 as printing accessories for wafer lapping per statistical notes. Prevents bow/warp in thin wafers.
Float Zone Crystal Grower
Float zone crystal growers use the float zone method to produce high-purity monocrystalline semiconductor boules without crucibles, ideal for silicon wafers. Classified in HTS 8443.99.5050 as other printing machinery accessories per statistical notes for semiconductor wafer manufacturing equipment. Critical for creating defect-free crystals used in device fabrication.
Crystal Boule Grinder
Crystal boule grinders precisely grind semiconductor crystal boules to exact diameters and flats indicating conductivity and resistivity, preparing for wafer slicing. Under HTS 8443.99.5050 as other parts/accessories for printing machinery in semiconductor wafer prep per statistical notes. Essential for dimensional accuracy in wafer production.
Wafer Slicing Diamond Saw
Wafer slicing saws with diamond blades cut ultra-thin semiconductor wafers from monocrystalline boules while minimizing damage. Classified HTS 8443.99.5050 as printing machinery accessories for semiconductor wafer manufacturing per statistical note (a)(ii)(B). Kerf loss control is critical for yield optimization.
Semiconductor Wafer Lapper
Wafer lappers use loose abrasives to achieve precise flatness and thickness uniformity on semiconductor wafers post-slicing. HTS 8443.99.5050 covers this as other printing accessories for wafer preparation per statistical notes (a)(ii)(C). Removes saw damage layer while controlling taper.
Chemical Mechanical Wafer Polisher
CMP polishers combine chemical slurry and mechanical action to planarize semiconductor wafers to atomic-level flatness for circuit fabrication. HTS 8443.99.5050 as other printing accessories for wafer polishing per statistical notes. Essential for multi-layer device processing.
Edge Profiling Wafer Grinder
Wafer edge grinders create chamfered edges to prevent chipping during handling and processing. Classified HTS 8443.99.5050 for semiconductor wafer grinding accessories. SEMI M20 edge geometry standards compliance.