Wafer Slicing Diamond Saw from China
Wafer slicing saws with diamond blades cut ultra-thin semiconductor wafers from monocrystalline boules while minimizing damage. Classified HTS 8443.99.5050 as printing machinery accessories for semiconductor wafer manufacturing per statistical note (a)(ii)(B). Kerf loss control is critical for yield optimization.
Duty Rate — China → United States
20%
Rate breakdown
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include blade specifications showing <50 micron kerf; critical for classification
• Document cleanroom compatibility (ISO Class 1); avoids general saw classification