Stress Relief Wafer Lapper from Mexico
Specialized lappers that remove stressed layers from inner wafer diameter after slicing. HTS 8443.99.5050 as printing accessories for wafer lapping per statistical notes. Prevents bow/warp in thin wafers.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document bow/warp reduction specifications
• Specify inner diameter lapping capability
• Avoid general 8464 classification