8443.99.50.50/Stress Relief Wafer Lapper/Japan

Stress Relief Wafer Lapper from Japan

Specialized lappers that remove stressed layers from inner wafer diameter after slicing. HTS 8443.99.5050 as printing accessories for wafer lapping per statistical notes. Prevents bow/warp in thin wafers.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document bow/warp reduction specifications

• Specify inner diameter lapping capability

• Avoid general 8464 classification