Stress Relief Wafer Lapper from Canada
Specialized lappers that remove stressed layers from inner wafer diameter after slicing. HTS 8443.99.5050 as printing accessories for wafer lapping per statistical notes. Prevents bow/warp in thin wafers.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document bow/warp reduction specifications
• Specify inner diameter lapping capability
• Avoid general 8464 classification