8443.99.50.50/Single-Side Wafer Polisher/Japan

Single-Side Wafer Polisher from Japan

Single-side wafer polishers create mirror-finish surfaces on semiconductor wafers using colloidal silica slurry for device fabrication readiness. Falls under HTS 8443.99.5050 as printing machinery parts for wafer polishing per statistical note (a)(ii)(C). Achieves sub-nanometer surface roughness.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Provide RMS surface roughness specs (<0.2 nm); differentiates from general polishers

• Include cleanroom integration requirements in technical docs

• Avoid 9018 classification; emphasize production-scale throughput