8443.99.50.50/Single-Side Wafer Polisher/China

Single-Side Wafer Polisher from China

Single-side wafer polishers create mirror-finish surfaces on semiconductor wafers using colloidal silica slurry for device fabrication readiness. Falls under HTS 8443.99.5050 as printing machinery parts for wafer polishing per statistical note (a)(ii)(C). Achieves sub-nanometer surface roughness.

Duty Rate — China → United States

20%

Rate breakdown

9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)

9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China

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Import Tips

• Provide RMS surface roughness specs (<0.2 nm); differentiates from general polishers

• Include cleanroom integration requirements in technical docs

• Avoid 9018 classification; emphasize production-scale throughput