Semiconductor Wafer Lapper from Japan
Wafer lappers use loose abrasives to achieve precise flatness and thickness uniformity on semiconductor wafers post-slicing. HTS 8443.99.5050 covers this as other printing accessories for wafer preparation per statistical notes (a)(ii)(C). Removes saw damage layer while controlling taper.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify total thickness variation <0.5 microns; key classification differentiator
• Require slurry system documentation showing semiconductor-grade materials