Semiconductor Wafer Lapper from Germany
Wafer lappers use loose abrasives to achieve precise flatness and thickness uniformity on semiconductor wafers post-slicing. HTS 8443.99.5050 covers this as other printing accessories for wafer preparation per statistical notes (a)(ii)(C). Removes saw damage layer while controlling taper.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Certify total thickness variation <0.5 microns; key classification differentiator
• Require slurry system documentation showing semiconductor-grade materials