Semiconductor Wafer Lapper from Germany
Wafer lappers use loose abrasives to achieve precise flatness and thickness uniformity on semiconductor wafers post-slicing. HTS 8443.99.5050 covers this as other printing accessories for wafer preparation per statistical notes (a)(ii)(C). Removes saw damage layer while controlling taper.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Certify total thickness variation <0.5 microns; key classification differentiator
• Require slurry system documentation showing semiconductor-grade materials