Semiconductor Wafer Lapper from China
Wafer lappers use loose abrasives to achieve precise flatness and thickness uniformity on semiconductor wafers post-slicing. HTS 8443.99.5050 covers this as other printing accessories for wafer preparation per statistical notes (a)(ii)(C). Removes saw damage layer while controlling taper.
Duty Rate — China → United States
20%
Rate breakdown
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Certify total thickness variation <0.5 microns; key classification differentiator
• Require slurry system documentation showing semiconductor-grade materials