Multi-Wire Wafer Slicing Saw from Mexico
Multi-wire saws use diamond-impregnated wires to simultaneously slice hundreds of wafers from semiconductor boules, minimizing material loss. Classified in HTS 8443.99.5050 as printing parts for wafer manufacturing per statistical note (a)(ii)(B). Enables high-volume 300mm wafer production.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify wire spacing <100 microns and boule size capacity (300mm+)
• Include slurry recycling system details showing production scale
• Avoid 8460 saw classification; reference statistical note wafer slicing provision