Multi-Wire Wafer Slicing Saw from Canada
Multi-wire saws use diamond-impregnated wires to simultaneously slice hundreds of wafers from semiconductor boules, minimizing material loss. Classified in HTS 8443.99.5050 as printing parts for wafer manufacturing per statistical note (a)(ii)(B). Enables high-volume 300mm wafer production.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify wire spacing <100 microns and boule size capacity (300mm+)
• Include slurry recycling system details showing production scale
• Avoid 8460 saw classification; reference statistical note wafer slicing provision