Edge Profiling Wafer Grinder from Japan
Wafer edge grinders create chamfered edges to prevent chipping during handling and processing. Classified HTS 8443.99.5050 for semiconductor wafer grinding accessories. SEMI M20 edge geometry standards compliance.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Reference SEMI M20 edge profiles in technical documentation
• Include throughput specs for production classification