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8443.99.50.50/Edge Profiling Wafer Grinder/Japan

Edge Profiling Wafer Grinder from Japan

Wafer edge grinders create chamfered edges to prevent chipping during handling and processing. Classified HTS 8443.99.5050 for semiconductor wafer grinding accessories. SEMI M20 edge geometry standards compliance.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Reference SEMI M20 edge profiles in technical documentation

• Include throughput specs for production classification

Edge Profiling Wafer Grinder from Japan — Import Duty Rate | HTS 8443.99.50.50