Double-Side Wafer Grinder from Mexico
Double-side grinders simultaneously process both wafer surfaces for thickness uniformity and parallelism prior to polishing. Under HTS 8443.99.5050 for semiconductor wafer grinding per statistical note (a)(ii)(C). Achieves <1 micron TTV across 300mm wafers.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Include carrier plate specifications showing multi-wafer batch processing
• Require semiconductor material qualification certificates
• Differentiate from general 8460 grinders via throughput specs