8443.99.50.50/Double-Side Wafer Grinder/Japan

Double-Side Wafer Grinder from Japan

Double-side grinders simultaneously process both wafer surfaces for thickness uniformity and parallelism prior to polishing. Under HTS 8443.99.5050 for semiconductor wafer grinding per statistical note (a)(ii)(C). Achieves <1 micron TTV across 300mm wafers.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include carrier plate specifications showing multi-wafer batch processing

• Require semiconductor material qualification certificates

• Differentiate from general 8460 grinders via throughput specs