8443.99.50.50/Double-Side Wafer Grinder/Germany

Double-Side Wafer Grinder from Germany

Double-side grinders simultaneously process both wafer surfaces for thickness uniformity and parallelism prior to polishing. Under HTS 8443.99.5050 for semiconductor wafer grinding per statistical note (a)(ii)(C). Achieves <1 micron TTV across 300mm wafers.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Include carrier plate specifications showing multi-wafer batch processing

• Require semiconductor material qualification certificates

• Differentiate from general 8460 grinders via throughput specs

Double-Side Wafer Grinder from Germany — Import Duty Rate | HTS 8443.99.50.50