Double-Side Wafer Grinder from Germany
Double-side grinders simultaneously process both wafer surfaces for thickness uniformity and parallelism prior to polishing. Under HTS 8443.99.5050 for semiconductor wafer grinding per statistical note (a)(ii)(C). Achieves <1 micron TTV across 300mm wafers.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include carrier plate specifications showing multi-wafer batch processing
• Require semiconductor material qualification certificates
• Differentiate from general 8460 grinders via throughput specs