Crystal Ingot Diameter Grinder from Japan
Precision grinders that shape crystal ingots to uniform diameter tolerances before wafer slicing, with automated profiling for resistivity flat marking. HTS 8443.99.5050 as other semiconductor wafer prep accessories per statistical notes. Maintains crystal orientation throughout process.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document flat positioning accuracy <0.5° for classification support
• Ship with calibration standards; CBP may test metrology capability
• Common misclassification as 8458 grinders; specify semiconductor end-use