Crystal Ingot Diameter Grinder from Japan
Precision grinders that shape crystal ingots to uniform diameter tolerances before wafer slicing, with automated profiling for resistivity flat marking. HTS 8443.99.5050 as other semiconductor wafer prep accessories per statistical notes. Maintains crystal orientation throughout process.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document flat positioning accuracy <0.5° for classification support
• Ship with calibration standards; CBP may test metrology capability
• Common misclassification as 8458 grinders; specify semiconductor end-use