Colloidal Silica Wafer Polisher from Mexico

Polishers using colloidal silica slurry for final semiconductor wafer surface preparation. HTS 8443.99.5050 for wafer polishers per statistical notes. Creates oxide layer for device processing.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Import Tips

Include slurry specifications and removal rates

Document cleanroom particle specs

Differentiate from CMP via chemistry