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8443.99.50.50/Colloidal Silica Wafer Polisher/Japan

Colloidal Silica Wafer Polisher from Japan

Polishers using colloidal silica slurry for final semiconductor wafer surface preparation. HTS 8443.99.5050 for wafer polishers per statistical notes. Creates oxide layer for device processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include slurry specifications and removal rates

• Document cleanroom particle specs

• Differentiate from CMP via chemistry