Colloidal Silica Wafer Polisher from Germany
Polishers using colloidal silica slurry for final semiconductor wafer surface preparation. HTS 8443.99.5050 for wafer polishers per statistical notes. Creates oxide layer for device processing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include slurry specifications and removal rates
• Document cleanroom particle specs
• Differentiate from CMP via chemistry