Chemical Mechanical Wafer Polisher from Japan
CMP polishers combine chemical slurry and mechanical action to planarize semiconductor wafers to atomic-level flatness for circuit fabrication. HTS 8443.99.5050 as other printing accessories for wafer polishing per statistical notes. Essential for multi-layer device processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document removal rate specs (>200 nm/min) and pad conditioning systems
• Classify complete toolset together; separate components risk different headings