Chemical Mechanical Wafer Polisher from China
CMP polishers combine chemical slurry and mechanical action to planarize semiconductor wafers to atomic-level flatness for circuit fabrication. HTS 8443.99.5050 as other printing accessories for wafer polishing per statistical notes. Essential for multi-layer device processing.
Duty Rate — China → United States
20%
Rate breakdown
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document removal rate specs (>200 nm/min) and pad conditioning systems
• Classify complete toolset together; separate components risk different headings