Wafer Slicing Saw Coolant Nozzle Array from Japan
Multi-nozzle coolant delivery system for wire or blade wafer saws, maintaining blade temperature below 40°C during silicon slicing. Prevents thermal damage to wafers. Parts of wafer slicing saws under 8442.40.00.00.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify nozzle count (16-64) and flow rate per nozzle (0.5-2 L/min)
• Stainless steel vs plastic construction affects corrosion resistance classification
• Test for DI water compatibility; non-semiconductor coolants may shift heading