Wafer Slicing Saw Coolant Nozzle Array from China
Multi-nozzle coolant delivery system for wire or blade wafer saws, maintaining blade temperature below 40°C during silicon slicing. Prevents thermal damage to wafers. Parts of wafer slicing saws under 8442.40.00.00.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Specify nozzle count (16-64) and flow rate per nozzle (0.5-2 L/min)
• Stainless steel vs plastic construction affects corrosion resistance classification
• Test for DI water compatibility; non-semiconductor coolants may shift heading