Wafer Lapping Machine Polishing Pad from Japan
Polyurethane polishing pad for wafer lappers and grinders that achieve sub-micron flatness on semiconductor wafers prior to fabrication. Designed for chemical-mechanical planarization compatibility. Part of wafer preparation apparatus under 8442.40.00.00.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify pad durometer, groove pattern, and compatible slurry types in documentation
• Import in cleanroom packaging to maintain classification as semiconductor-specific consumables
• Monitor for wear indicators; partial pads may classify differently than full replacements