8442.40.00.00/Wafer Lapping Machine Polishing Pad/Japan

Wafer Lapping Machine Polishing Pad from Japan

Polyurethane polishing pad for wafer lappers and grinders that achieve sub-micron flatness on semiconductor wafers prior to fabrication. Designed for chemical-mechanical planarization compatibility. Part of wafer preparation apparatus under 8442.40.00.00.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify pad durometer, groove pattern, and compatible slurry types in documentation

• Import in cleanroom packaging to maintain classification as semiconductor-specific consumables

• Monitor for wear indicators; partial pads may classify differently than full replacements