Wafer Lapping Machine Polishing Pad from Germany
Polyurethane polishing pad for wafer lappers and grinders that achieve sub-micron flatness on semiconductor wafers prior to fabrication. Designed for chemical-mechanical planarization compatibility. Part of wafer preparation apparatus under 8442.40.00.00.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify pad durometer, groove pattern, and compatible slurry types in documentation
• Import in cleanroom packaging to maintain classification as semiconductor-specific consumables
• Monitor for wear indicators; partial pads may classify differently than full replacements