</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8442.40.00.00/Wafer Lapping Machine Polishing Pad/Canada

Wafer Lapping Machine Polishing Pad from Canada

Polyurethane polishing pad for wafer lappers and grinders that achieve sub-micron flatness on semiconductor wafers prior to fabrication. Designed for chemical-mechanical planarization compatibility. Part of wafer preparation apparatus under 8442.40.00.00.

Duty Rate — Canada → United States

10%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify pad durometer, groove pattern, and compatible slurry types in documentation

• Import in cleanroom packaging to maintain classification as semiconductor-specific consumables

• Monitor for wear indicators; partial pads may classify differently than full replacements

Wafer Lapping Machine Polishing Pad from Canada — Import Duty Rate | HTS 8442.40.00.00