8442.40.00.00/Wafer Lapping Machine Polishing Pad/Canada

Wafer Lapping Machine Polishing Pad from Canada

Polyurethane polishing pad for wafer lappers and grinders that achieve sub-micron flatness on semiconductor wafers prior to fabrication. Designed for chemical-mechanical planarization compatibility. Part of wafer preparation apparatus under 8442.40.00.00.

Duty Rate — Canada → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify pad durometer, groove pattern, and compatible slurry types in documentation

• Import in cleanroom packaging to maintain classification as semiconductor-specific consumables

• Monitor for wear indicators; partial pads may classify differently than full replacements

Wafer Lapping Machine Polishing Pad from Canada — Import Duty Rate | HTS 8442.40.00.00