Wafer Lapping Machine Polishing Pad from Canada
Polyurethane polishing pad for wafer lappers and grinders that achieve sub-micron flatness on semiconductor wafers prior to fabrication. Designed for chemical-mechanical planarization compatibility. Part of wafer preparation apparatus under 8442.40.00.00.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify pad durometer, groove pattern, and compatible slurry types in documentation
• Import in cleanroom packaging to maintain classification as semiconductor-specific consumables
• Monitor for wear indicators; partial pads may classify differently than full replacements