Wafer Grinder Air Bearing Chuck from Japan
Porous ceramic air bearing chuck that holds semiconductor wafers during grinding with near-zero friction and contamination. Maintains wafer flatness within 0.1 microns. Essential part of wafer grinder/polisher equipment under 8442.40.00.00.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide porosity specs (20-40%) and air pressure ratings (40-60 psi) in import docs
• Cleanroom certification and ESD-safe handling required for proper entry
• Single vs multi-wafer chucks may affect valuation; specify capacity clearly