Wafer Grinder Air Bearing Chuck from Japan
Porous ceramic air bearing chuck that holds semiconductor wafers during grinding with near-zero friction and contamination. Maintains wafer flatness within 0.1 microns. Essential part of wafer grinder/polisher equipment under 8442.40.00.00.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide porosity specs (20-40%) and air pressure ratings (40-60 psi) in import docs
• Cleanroom certification and ESD-safe handling required for proper entry
• Single vs multi-wafer chucks may affect valuation; specify capacity clearly