8442.40.00.00/Wafer Grinder Air Bearing Chuck/Japan

Wafer Grinder Air Bearing Chuck from Japan

Porous ceramic air bearing chuck that holds semiconductor wafers during grinding with near-zero friction and contamination. Maintains wafer flatness within 0.1 microns. Essential part of wafer grinder/polisher equipment under 8442.40.00.00.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Provide porosity specs (20-40%) and air pressure ratings (40-60 psi) in import docs

• Cleanroom certification and ESD-safe handling required for proper entry

• Single vs multi-wafer chucks may affect valuation; specify capacity clearly

Wafer Grinder Air Bearing Chuck from Japan — Import Duty Rate | HTS 8442.40.00.00