Wafer Grinder Air Bearing Chuck from China
Porous ceramic air bearing chuck that holds semiconductor wafers during grinding with near-zero friction and contamination. Maintains wafer flatness within 0.1 microns. Essential part of wafer grinder/polisher equipment under 8442.40.00.00.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide porosity specs (20-40%) and air pressure ratings (40-60 psi) in import docs
• Cleanroom certification and ESD-safe handling required for proper entry
• Single vs multi-wafer chucks may affect valuation; specify capacity clearly