Wafer Thickness Grinder from Japan
Stress-free grinders control semiconductor wafer thickness to nanometer precision using low-stress diamond wheels. Classified under HTS 8442.30.01 for printing component finishing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Thickness control resolution (<0.1μm)
• In-situ measurement integration documentation
• Dry grinding capability declaration