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8442.30.01/Wafer Thickness Grinder/Japan

Wafer Thickness Grinder from Japan

Stress-free grinders control semiconductor wafer thickness to nanometer precision using low-stress diamond wheels. Classified under HTS 8442.30.01 for printing component finishing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Thickness control resolution (<0.1μm)

• In-situ measurement integration documentation

• Dry grinding capability declaration

Wafer Thickness Grinder from Japan — Import Duty Rate | HTS 8442.30.01