Wafer Thickness Grinder from Germany
Stress-free grinders control semiconductor wafer thickness to nanometer precision using low-stress diamond wheels. Classified under HTS 8442.30.01 for printing component finishing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Thickness control resolution (<0.1μm)
• In-situ measurement integration documentation
• Dry grinding capability declaration