8442.30.01/Wafer Slicing Diamond Saw/Japan

Wafer Slicing Diamond Saw from Japan

Inner-diameter diamond saws slice ultra-thin semiconductor wafers from monocrystalline boules with minimal kerf loss. HTS 8442.30.01 applies for equipment preparing printing components from semiconductor stock.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify diamond blade specifications and wafer thickness capability (<100μm)

• Include cooling slurry system details for proper valuation

Wafer Slicing Diamond Saw from Japan — Import Duty Rate | HTS 8442.30.01