</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8442.30.01/Wafer Slicing Diamond Saw/Japan

Wafer Slicing Diamond Saw from Japan

Inner-diameter diamond saws slice ultra-thin semiconductor wafers from monocrystalline boules with minimal kerf loss. HTS 8442.30.01 applies for equipment preparing printing components from semiconductor stock.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify diamond blade specifications and wafer thickness capability (<100μm)

• Include cooling slurry system details for proper valuation

Wafer Slicing Diamond Saw from Japan — Import Duty Rate | HTS 8442.30.01