Wafer Slicing Diamond Saw from Germany
Inner-diameter diamond saws slice ultra-thin semiconductor wafers from monocrystalline boules with minimal kerf loss. HTS 8442.30.01 applies for equipment preparing printing components from semiconductor stock.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify diamond blade specifications and wafer thickness capability (<100μm)
• Include cooling slurry system details for proper valuation