Wafer Slicing Diamond Saw from Canada
Inner-diameter diamond saws slice ultra-thin semiconductor wafers from monocrystalline boules with minimal kerf loss. HTS 8442.30.01 applies for equipment preparing printing components from semiconductor stock.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify diamond blade specifications and wafer thickness capability (<100μm)
• Include cooling slurry system details for proper valuation