</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8442.30.01/Wafer Edge Profiling Machine/Japan

Wafer Edge Profiling Machine from Japan

Edge grinders profile semiconductor wafer edges to prevent chipping during handling and processing. HTS 8442.30.01 for printing component preparation equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Edge geometry specifications (chamfer angle, radius)

• Vacuum chuck flatness critical for classification

• Consumable grinding wheels declared separately