Semiconductor Polishing Head Assembly from Japan
Precision polishing head units apply controlled pressure to individual wafers during CMP processing. HTS 8442.30.01 parts for printing equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Head count and pressure range specifications
• Retaining ring material and wear rate data
• Compatibility with specific CMP platforms