Semiconductor Polishing Head Assembly from Japan
Precision polishing head units apply controlled pressure to individual wafers during CMP processing. HTS 8442.30.01 parts for printing equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Head count and pressure range specifications
• Retaining ring material and wear rate data
• Compatibility with specific CMP platforms