Semiconductor Polishing Head Assembly from Germany
Precision polishing head units apply controlled pressure to individual wafers during CMP processing. HTS 8442.30.01 parts for printing equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Head count and pressure range specifications
• Retaining ring material and wear rate data
• Compatibility with specific CMP platforms