8442.30.01/Precision Wafer Grinder/Japan

Precision Wafer Grinder from Japan

Single-side wafer grinders back-grind wafers to ultra-thin dimensions (<50μm) while maintaining die strength. Under HTS 8442.30.01 for semiconductor printing component preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document minimum grind thickness and taper control specifications

• Temporary bonding systems classified separately under 8442.90 parts

• High-value diamond wheels declared as accessories