Precision Wafer Grinder from Germany
Single-side wafer grinders back-grind wafers to ultra-thin dimensions (<50μm) while maintaining die strength. Under HTS 8442.30.01 for semiconductor printing component preparation.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document minimum grind thickness and taper control specifications
• Temporary bonding systems classified separately under 8442.90 parts
• High-value diamond wheels declared as accessories