Precision Wafer Grinder from Canada
Single-side wafer grinders back-grind wafers to ultra-thin dimensions (<50μm) while maintaining die strength. Under HTS 8442.30.01 for semiconductor printing component preparation.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document minimum grind thickness and taper control specifications
• Temporary bonding systems classified separately under 8442.90 parts
• High-value diamond wheels declared as accessories