Precision Wafer Grinder from Canada
Single-side wafer grinders back-grind wafers to ultra-thin dimensions (<50μm) while maintaining die strength. Under HTS 8442.30.01 for semiconductor printing component preparation.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document minimum grind thickness and taper control specifications
• Temporary bonding systems classified separately under 8442.90 parts
• High-value diamond wheels declared as accessories