Automated Wafer Preparation Line from Japan
Integrated systems combining grinding, lapping, polishing for complete wafer preparation from boule. Comprehensive HTS 8442.30.01 printing component machinery.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• System throughput and yield specifications
• Cleanroom classification (ISO 3-5)
• Modular component valuation breakdown