</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8442.30.01/Automated Wafer Preparation Line/China

Automated Wafer Preparation Line from China

Integrated systems combining grinding, lapping, polishing for complete wafer preparation from boule. Comprehensive HTS 8442.30.01 printing component machinery.

Duty Rate — China → United States

37.5%

Rate breakdown

9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Calculate with your customs valueVerify classification with AI

Import Tips

• System throughput and yield specifications

• Cleanroom classification (ISO 3-5)

• Modular component valuation breakdown