8442.30.01.50/Wafer Lapping Machine/Japan

Wafer Lapping Machine from Japan

Automatic wafer lapping machines use planetary motion between conditioning rings to lap multiple wafers simultaneously to precise thickness tolerances. Prepares surface for polishing. Classified HTS 8442.30.0150.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Detail ring carrier configurations (6-12 wafers) and rotation speeds

• Include lapping plate flatness control specifications

• Document slurry flow and waste handling systems