Wafer Lapping Machine from Japan
Automatic wafer lapping machines use planetary motion between conditioning rings to lap multiple wafers simultaneously to precise thickness tolerances. Prepares surface for polishing. Classified HTS 8442.30.0150.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Detail ring carrier configurations (6-12 wafers) and rotation speeds
• Include lapping plate flatness control specifications
• Document slurry flow and waste handling systems