8442.30.01.50/Wafer Lapping Machine/Germany

Wafer Lapping Machine from Germany

Automatic wafer lapping machines use planetary motion between conditioning rings to lap multiple wafers simultaneously to precise thickness tolerances. Prepares surface for polishing. Classified HTS 8442.30.0150.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Detail ring carrier configurations (6-12 wafers) and rotation speeds

• Include lapping plate flatness control specifications

• Document slurry flow and waste handling systems

Wafer Lapping Machine from Germany — Import Duty Rate | HTS 8442.30.01.50