Wafer Lapping Machine from Germany
Automatic wafer lapping machines use planetary motion between conditioning rings to lap multiple wafers simultaneously to precise thickness tolerances. Prepares surface for polishing. Classified HTS 8442.30.0150.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Detail ring carrier configurations (6-12 wafers) and rotation speeds
• Include lapping plate flatness control specifications
• Document slurry flow and waste handling systems